We search for industry news, so you don't need to.
|
|
|
|
|
|
|
|
|
|
|
Mark McMeen |
No. 53939 |
VP Engineering Services
STI Electronics Inc.
mmcmeen@solderingtech.com
Mark T. McMeen is STI Electronics Inc.ʼs Vice President of Engineering Services. He oversees the daily operations of the Engineering Services division of STI. He has over 18 years experience in the manufacturing and engineering of PCBs.
|
Experts Questions Answered by Mark McMeen
|
Apr 26, 2010 |
Organic Flux Residue Concerns
|
|
Dec 7, 2009 |
SMT Component Lead Oxidation
|
|
Aug 24, 2009 |
Delamination dilemma
|
|
Aug 24, 2009 |
Cutting inner layer circuits
|
|
Aug 10, 2009 |
Reworked BGA component bridging at the corners
|
|
Jun 1, 2009 |
Technology to Measure Oxidation Levels
|
|
May 4, 2009 |
Nickel Barrier Thickness Requirement
|
|
Jan 26, 2009 |
Wave solder process issue
|
|
Jan 26, 2009 |
BGA Replacement limit
|
|
Jan 12, 2009 |
Pre-Bake Standard for Rework
|
|
Dec 22, 2008 |
Procedure for Baking Flexible Circuits
|
|
Nov 17, 2008 |
Lead frame contamination
|
|
Nov 10, 2008 |
Opens on BGA solder joints after reflow soldering
|
|
|
|
|
|
|
|
