White Paper Download Index Dry Film Photoresist & Material Solutions for 3D/TSV Following a short synopsis of market trends and 3D integration approaches, the white paper details "via last" surface and back via process schemes and then discusses photoresist solutions for TSV, bonding and 3D integration. DuPont EKC Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 929 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.