NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will exhibit AQUANOX® A4241 PCB and Stencil Cleaner at the tabletop Cemconex exhibition and will present a paper during the conference. Cemconex is scheduled to take place October 17, 2008 in Timisoara, Romania.

AQUANOX® A4241 is an aqueous cleaning solution designed with a revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. Kyzen introduces a product that can be used in a multi-process environment for use in spray batch, spray in-line and stencil cleaning processes. A4241 will provide brilliant solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring. AQUANOX® A4241 is multi-metal safe including bare aluminum and copper.

A non-flammable, non-corrosive liquid, AQUANOX® A4241 has been proven to be compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. AQUANOX® A4241 is a non-hazardous, biodegradable aqueous solution that contains no CFCs or HAPs.

The Kyzen Applications Laboratory has evaluated AQUANOX® A4241 for effective removal of nearly 300 soldering materials from the world’s leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Balver Zinn GmbH & Co. KG, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.

Also, during the conference session of Cemconex, Serge Tuerlings, Kyzen’s European Technical Manager, will present “Innovative Engineered Cleaning Fluid Designed to Remove Process Soils from Stencils, SMT, and Rework in Batch and Inline Cleaning Equipment.” The paper is authored by Kyzen’s Mike Bixenman, Fernando Rueda and Serge Tuerlings.