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Steven Adamson |
No. 52777 |
Market Specialist
Nordson ASYMTEK
steven.adamson@nordsonasymtek.com
Steven Adamson is Market Specialist for Nordson ASYMTEK. He has worked for Kodak, Motorola and Plessey, ICL in the UK. He holds five US and 2 UK patents, was awarded a HNC in electrical engineering and was 2008 President of IMAPS.
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Experts Questions Answered by Steven Adamson
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Aug 23, 2010 |
Post Print Inspection Issue
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Aug 9, 2010 |
Flux Residue Causing Test Issues
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Aug 9, 2010 |
Solder Mask Contributing To Solder Balls
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Jul 19, 2010 |
Gold Plated Lead Discoloration
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Jun 28, 2010 |
Through Hole Component Phase Out
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Jun 21, 2010 |
Component Storage Recommendations
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May 24, 2010 |
Humidity Inside Our Screen Printer
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May 24, 2010 |
Lead-Free Profile on Tin/Lead Assemblies
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May 10, 2010 |
Can Water be Harmful to Electronics Components?
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Apr 26, 2010 |
How To Mask Areas During Conformal Coating
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Apr 26, 2010 |
Organic Flux Residue Concerns
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Apr 5, 2010 |
Lead-free Assemblies Reworked with Leaded Solder
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Apr 5, 2010 |
Cause of Pin Hole Rejects
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Mar 29, 2010 |
Do We Need to Conformally Coat Edges?
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Mar 22, 2010 |
Soldering lead-free component, with tin-lead solder
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Mar 8, 2010 |
Re-plating lead-free components for tin/lead assembly
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Mar 8, 2010 |
Contamination Prior to Conformal Coating
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Mar 1, 2010 |
When Should We Use Underfill?
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Feb 8, 2010 |
Leadless Component Hand Soldering Help
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Feb 1, 2010 |
BGA Shifting During Reflow
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Jan 17, 2010 |
Epoxy Bonding Problems on RoHS Boards
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Dec 14, 2009 |
Contamination from Cigarette Smoking
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Dec 7, 2009 |
SMT Component Lead Oxidation
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Nov 23, 2009 |
Concerns Using Hand Sanitizers
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Nov 23, 2009 |
Cause of Yellow/Brown Discoloration
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Oct 27, 2009 |
Tacky Flux Residue Problem
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Oct 5, 2009 |
Affects of Silicone Migration
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Sep 28, 2009 |
Solder Joint Explosions
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Sep 28, 2009 |
Spray Fluxer Uniformity Question
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Sep 14, 2009 |
Hard Water Contamination
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Aug 31, 2009 |
Mysterious Solder Balls
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Aug 24, 2009 |
Delamination dilemma
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Aug 10, 2009 |
Need for SMT adhesives
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Jul 6, 2009 |
How to predict possible intermetallics
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Jun 22, 2009 |
Ultrasonic Cleaning Causing Damage
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Jun 15, 2009 |
What is the Proper DI Water Resistivity
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Jun 10, 2009 |
Recertify PCB's past their shelf life
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May 26, 2009 |
Which term to use, PWB or PCB?
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May 26, 2009 |
Difference between shiny and matt solder resist
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Apr 13, 2009 |
Exposed Copper on Gold Plated Conductors
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Mar 30, 2009 |
Alternative to Conformal Coating
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Mar 9, 2009 |
How to bond heavy component to PCB
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Feb 16, 2009 |
Conformal coating and connector holes
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Dec 22, 2008 |
Procedure for Baking Flexible Circuits
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Dec 14, 2008 |
IPA cleaning precautions
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Dec 10, 2008 |
Conformal Coating Process
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Nov 24, 2008 |
Solder Bump QFN's
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Nov 24, 2008 |
Define Blow Holes
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Nov 3, 2008 |
Idle Time Between Soldering and Cleaning
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Nov 3, 2008 |
Lifecycle Standards
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Oct 27, 2008 |
Adhesive for sensor attachment
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Oct 13, 2008 |
Solder to a thin flexible circuit
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Oct 13, 2008 |
Substance causing open BGA solder joints
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Oct 6, 2008 |
Oxidation on pads causes poor solder joints
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Oct 6, 2008 |
IR Reflow Issue
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