OSAKA, JAPAN — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that has been awarded a Global Technology Award in the category of Best Asian Product 2008 for its innovative NS-F850. The award was presented by Global SMT & Packaging Magazine’s Publisher and Editor-in-Chief Trevor Galbraith during a Tuesday, August 19, 2008 ceremony that took place during the SMTA International exhibition and conference in Orlando, FL.

NS-F850 is a rosin-based flux for lead-free wave soldering. The flux ensures excellent wetting of all PCB and component substrates to deliver maximum through-hole fill and facilitates the solder drainage that ensures minimum bridges and icicles. It is the ideal flux for lead-free wave soldering.

NS-F850 prevents solder balls adhering to solder mask, ensures that the full reliability potential of SN100C lead-free solder is realized and provides excellent wetting. Additionally, its matte finish facilitates inspection after soldering.

The Global Technology Awards program is sponsored by Global SMT & Packaging Magazine, and is an annual celebration of product excellence in semiconductor packaging and electronics assembly. Premier products based on the finest examples of creative advancement in technology in key areas are chosen by a distinguished panel of global industry experts.