Cookson Electronics’ Engineered Products Group to Exhibit at SMTAI
South Plainfield, NJ – Cookson Electronics Engineered Products will be exhibiting its advanced stencil technologies at the SMTAI show in Orlando, August 19th and 20th 2008, as part of the Cookson Electronics Assembly Materials exhibit in Booth # 210.
Cookson Electronics Engineered Products will be featuring its ALPHA® CUT, ALPHA® NICKEL and ALPHA® FORM product lines as well as advanced stencil services, including Data Scaling.
“The SMTAI Show is an important venue to showcase advanced assembly technology. We are pleased to exhibit our value-added stencil technologies that can help OEMs and CEMs get their new products to markets quicker and help improve first pass yields” said Ravi Bhatkal, Cookson Electronics’ Vice President and General Manager, Engineered Products.
Recently, Cookson Electronics Engineered Products has launched its “First-Time-Right” NPI (New Product Introduction) Stencils Initiative for its ALPHA® branded “Engineered Products” (stencils) product line, to help electronics assemblers and prototyping houses reduce their NPI cycle times, improve first pass yields and enable new product assembly.
With over 800 man years of combined experience in the stencils business, Cookson Electronics’ Engineered Products Group helps the NPI community by:
Engaging with the customer early in the design process, to understand customer requirements.
Supporting the design effort by providing Cookson’s design recommendations, that are based on Cookson’s deep knowledge of the printing process, that enables the right paste volume to be deposited in the right place, consistently.
Automated application of pre-programmed customer and OEM/Product-specific design rules through Cookson’s patented DIMENSIONS® system, that reduces the possibility of CAD errors in applying design modifications.
Application of DIMENSIONS® system to apply one set of design rules at multiple sites globally (via both pre-programmed and continuous addition of new design rules).
Providing Cookson’s PCB Scaling Service that can optimize the stencil to better correct for board stretch. Scaling of the stencil design to the corresponding PCB, thus reducing defects and rework, and improving first pass yield in the NPI process.
Regular monitoring and control of the positional accuracy of Cookson’s lasers, to provide accurate and consistent stencil quality.
Providing stepped stencils and unique aperture designs developed by Cookson to allow single stencils designed for broad range of deposit volumes to provide the right paste volume where needed.
Providing fast turnaround of the stencils from one of our 12 strategic global locations.
Providing ALPHA® Global Technical Service and Support, and Cookson’s deep technical knowledge of the printing process, to help implement our stencils in the field and troubleshoot if necessary, enabling the customer achieve higher first pass yields and faster implementation.
* Not all services are available yet in each global market.
