OSAKA, JAPAN — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the technical conference as well as exhibit at the upcoming SMTA International Conference & Exhibition, scheduled to take place August 17-21, 2008 at Disney's Coronado Springs Resort in Orlando, FL.

Nihon Superior’s Keith Sweatman will present in conjunction with Joelle Arnold of DfR Solutions on “Reliability Testing of Ni-Modified SnCu and SAC305 – Vibration”. The paper provides some preliminary evidence that the Ni-modified SnCu can be used with confidence as an alternative to SAC305 as a lead-free solder in a wide range of service environments and provides some benchmarking of the Ni-modified against Sn-37Pb and SAC305. Mr. Sweatman also will participate in a panel discussion on Lead-Free Alloy Alternatives, which will take place during Session LF1 in the Lead-Free Soldering Symposium from 8 to 9:30 a.m. in Coronado A on Thursday, August 21, 2008. This session will begin with a presentation of the results from an iNEMI study into the present state of industry knowledge on “alternative” Sn-Ag-Cu alloys and an assessment of critical gaps. This will be followed by a panel discussion with experts from all segments of the industry, including solder suppliers, EMS providers, component manufacturers, and OEMs.

Nihon Superior USA will introduce two new halogen-free products during the SMTAI Exhibition, in booth 534, based upon its SN100C (Sn-Cu-Ni+Ge) alloy. SN100C (040) eCore Flux Cored Wire is completely halogen-free as it is absent of fluorine, chlorine, and other halogens. It provides low spatter with good solder tip separation from the joint for high productivity. SN100C P600 Halogen-free ePaste Solder Paste offers stable printability, excellent wetting properties, and the formation of stable intermetallic layer resulting in high reliability joints with SN100C.