LITTLETON, MASS. - VJ Electronix Inc., the leader in X-ray inspection technology and Rework systems, announces that it will highlight Summit 1800, an advanced rework system, in distributor Kasion’s booth 2F20 at the upcoming NEPCON/EMT South China exhibition and conference - scheduled to take place August 26 - 29, 2008, at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
VJ Electronix’s Summit 1800 Rework system provides some of the most advanced features designed specifically to address the most difficult rework challenges, including lead-free rework for large components. An increased 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets and connectors. The addition of programmable, motor-controlled top heater positioning in conjunction with the Summit’s independent pick-up motion provides the ultimate in process flexibility.
VJ Electronix’s Windows-based SierraMate 7.0 software improves on the Summit’s industry-proven simple operation and process control. New Advanced Auto Profile with rules-based process development allow process engineers to set specific constraints to be applied during automatic profile generation. This is a significant benefit for lead-free processes.
An automatic prism shuttle designed to accommodate large components facilitates accurate and repeatable component alignment. The system simultaneously looks up at the component and down at the board, providing a composite alignment view. The digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a simple click on the graphical user interface.
The Summit 1800 incorporates independent, programmable motions for both pick-up and top heater height. The pick-up motion allows precise placement force control and zero force removal. The component pick-up tube features 360° Theta control and automatic alignment height, ensuring proper focus and image magnification of components to be placed. Programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force, or to be located at a pre-set gap above the board.
With standard board handling of 18 x 22", placement accuracy of 0.0005 to 0.001" and magnification capability from 2 to 40X, the Summit 1800 offers users numerous benefits, including advanced thermal data collection and analysis with trend capability, password-protected user accounts, and positive flow control for peak temperature protection of delicate components. Additionally, the system can rework the following applications: MCM, BGA, QFP, CPU sockets, vertical connectors, straddle mount connectors, passive components, microSMD, flip chip, microBGA and CSP.
Various options are available for the Summit 1800, which include manual scavenger, component print station, cooling boost, sliding board support, 17" LCD monitor and 22 x 30" board size upgrade.
