To expand on the answer to the Ask the Experts column, Procedure for handling moisture sensitive PCB's, IPC task group D-35 is developing a guide for storage and handling of bare boards. This group has recently expanded the scope of the project to include test methods for classifying MSL of bare boards. IPC, ECA and JEDEC are preparing to publlish J-STD-075 that will provide moisture and thermal classification methods for passives, connectors, switches--anything else that might go through a wave or reflow oven (except PCBs). J075 is projected to be released by the end of August. BTW, J-STD-033 is the correct standard for handling & packaging MSDs.