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Solder Paste Inspection Technologies - 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology Manufacturing Processes. In addition, transition to lead free solder paste and use of miniature components, has increased the complexity of the printing process. Read more ... Speedline Technologies, Inc. Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. | ||
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