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July 11, 2008
Photo Stencil to Present Paper at SMTAI
COLORADO SPRINGS, Colorado – Dr. Bill Coleman, Photo Stencil’s vice president of technology, will present a paper titled “Squeegee Blade Design for Step Stencils” at the SMTA International Electronics Exhibition and Technical Conference in Orlando on August 19.
Step stencils are used when additional paste height is required for components with coplanarity issues, such as ceramic BGAs, surface mount connectors and RF shields. Although many step stencils can be successfully printed with standard rubber or metal squeegee blades, “high step” stencils (step height greater than 75 microns) may require special slit or notched blades. Dr. Coleman’s paper reviews several challenging scenarios and discusses blade designs that will achieve successful, defect-free printing.
The paper will be presented in Technical Session SMT1 on August 19 beginning at 10:00 am. The technical program is held August 17-21 at the Disney Coronado Springs Resort and Convention Center in Orlando. For additional information on the conference and exhibition, visit www.smta.org/smtai/. Visit www.photostencil.com for more information on step stencils and squeegee blades.
Contact:
Photo Stencil
Keith Favre
http://www.photostencil.com
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