LOS ALAMITOS, CA — Practical Dummy Components is now supplying the Amkor FusionQuad™, representing a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad™ QFP and MLF^® technologies. FusionQuad™ is based on the addition of exposed bottom lands within a standard VQFP package format. The novel integration of bottom lands provides a cost-effective platform for increased lead count in a small form factor.

FusionQuad™ not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount. Additionally, FusionQuad™ provides short signal paths to the bottom lands and high power dissipation capability with the solderable exposed die attach paddle.

FusionQuad™ offers a unique blend of excellent electrical and thermal performance in a miniaturized cost-effective leadframe plastic package. The unique footprint of FusionQuad™ allows for the use of low-cost printed circuit boards in the end application due to the space available for coarse routing vias between the bottom lands and the outer peripheral leads.

In cases where only their mechanical characteristics are required, Practical Dummy Components can be used instead of live, functioning components. Because there is no expensive die inside the package, the cost for performing mechanical testing is significantly lower.

A Practical Dummy Component is the exact mechanical equivalent of a live component used only when the physical properties of the components are required.

Practical Dummy Components are not inferior FR4 mock-ups. Practical Dummy Components are the exact same components, made on the same manufacturing lines as their live counterparts, but manufactured without the expensive die inside.