On behalf of the Pan Pacific Symposium Technical Committee, our General Chair, Yutaka Tsukada, Kyocera Wireless, and our Technical Co-Chairs, Soren Norlyng, MICRONSULT and Juergen Wolf, Fraunhofer Institute, we would like to invite you to submit an abstract for our 14th Annual Pan Pac event. This year’s conference will be held on the spectacular Big Island of Hawaii on February 10 – 12, 2009.

We are looking for papers in the following areas:
Assembly
Business Issues
Interconnection
Markets
Microsystems Technology
Packaging
Solar Electronics

DEADLINE FOR ABSTRACTS IS JULY 31st.

The full call for papers can be found at www.smta.org/panpac/call_for_papers.cfm. Abstracts can be easily submitted on line.

If you are looking for an event that promotes international technical interchange as well as extensive networking between those in the US and the Pacific Rim then this is the event for you. If you or your company is doing business internationally or are looking to expand into the international market, this is a “must attend” conference. We look forward to receiving your abstract.