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June 27, 2008

Photo Stencil to Offer Process Seminars Prior to 2008 U.S. Senior Open Championship

COLORADO SPRINGS, Colorado – Photo Stencil, a proud supporter of the 2008 U.S. Senior Open, will be conducting a series of printing process and stencil technology seminars during the week of the golf championship. The first round of this national event begins July 31, and the final round is held on Sunday, August 3 at the Broadmoor in Colorado Springs. Morning seminars will be held on July 30, 31, and August 1, and attendees are invited to the U.S. Senior Open courtesy of Photo Stencil.

Each day, Wednesday through Friday, a facility tour commences at 8:00 am, followed by a process seminar from 8:30 to 10:30. On July 30, the first part of the class will review printing process basics and parameters. The second half concentrates on stencil design and applications. The July 31 class covers lead-free process implications and intrusive reflow for tin/lead and lead-free solder. The final class, on August 1, presents independent research on print performance of various stencil technologies, such as electroform, laser, and laser with electropolish/nickel plating. Squeegee blade design and applications and print process troubleshooting are also reviewed.

At the end of each session, Photo Stencil personnel will be on hand for open discussion and one-on-one consultation. Attendees are invited to review their “problem boards” and process challenges with the company’s engineers.

The classes are held at Photo Stencil, 4725 Centennial Boulevard, Colorado Springs, Colorado. There is no charge for the seminars, and attendees will be provided with courtesy passes to the U.S. Senior Open. This national championship is conducted by the United States Golf Association (USGA). For additional information and reservations, contact Photo Stencil at (719) 599-4305. Visit the U.S. Senior Open website at www.ussenioropen.com. For product information, visit www.photostencil.com.

Contact:
Photo Stencil

Keith Favre
http://www.photostencil.com

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