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June 23, 2008
Photo Stencil Expands Capability and Capacity
COLORADO SPRINGS, Colorado – Photo Stencil recently completed a significant phase of its ongoing expansion program. The latest milestone included new production equipment, additional personnel, new internal systems and facilities expansion all dedicated to increased capability and capacity.
A new LPKF StencilLaser G 6080 was brought online at the company’s headquarters in Colorado Springs. This system features next-generation architecture and increased performance with cutting speeds up to 50% faster than other laser systems currently available. A faster loading routine shortens changeover time and increases utilization. The LPKF machine will be used on all laser cut stencils including the DuraAlloy™ and NicAlloy™ product lines.
According to Todd Woods, chief operating officer, “The new laser system is just part of our overall expansion plan. We have also upgraded our photoplotting infrastructure and added capacity and capability in our E-Fab® electroformed stencil manufacturing department. And, along with increased capacity, we’ve incorporated supporting procedures and documentation for our ISO 9001:2000 quality system.”
Photo Stencil recently added personnel at all levels and facilities in the organization. Notably, Dr. James Reilly joined the management team as vice president of research and development. Their manufacturing facility in Penang, Malaysia was also expanded.
President and CEO, Keith Favre, summarized the efforts: “Although the U.S. economy is soft, we are basing our strategic plans on the global economy. Rapid technological change and industrialization continue to drive the demand for electronics and, of course, stencils. We are prepared to meet not only the challenges of smaller apertures and tighter tolerances, but also the need for excellence in customer support and responsiveness.”
Contact:
Photo Stencil
Keith Favre
http://www.photostencil.com
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