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May 16, 2008
USI Announces Advancements in Photoresist Coating
for Wafers and Mems Devices
Haverhill, MA – USI has developed a spray coating technology for thin-film photoresist applications on non-traditional wafers and MEMS devices. The Ultrasonic Coating Technologyhas proveneffectivein applying a thin, uniform coating of photoresist in applications wherethe spin coating method is ineffective, such as those with micro vias and non-circular designs.
USI's Ultra-Spray Technologyenablesa more accurate, thinner coating application than conventional spraycoating technology. Thesystem utilizes a "nozzle-less" ultrasonic spray head and a high performance X-Y-Z motion control platformfor development and production environments.
If you would like more details contact Bob LePage at 978-521-0095 or via email at mailto:rlepage@ultraspray.com.
Contact:
Ultrasonic Systems
Bob LePage
http://www.ultraspray.com
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