We search for industry news, so you don't need to.   Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Experts  I  Equipment  I  Marketplace  I  Calendar May 15, 2008 Reduce voiding and head-in-pillow with AIM's NC257 Lead-Free Solder Paste AIM's NC257 Lead-Free No-Clean Solder Paste has proven to greatly reduce or eliminate defects such as voiding under µBGAs, head-in-pillow and solder beading by discrete components. Click here to learn more… AIM   Standardized Traceability Ratings for Manufacturing Until now, the PCB industry has lacked a common language for manufacturing traceability. Aegis Software offers guidelines to benchmark your company's traceability rating. Click here to learn more… Aegis Software Letters Submit Industry Forums   Large Box Oven Time Needed PM Software   Transport 450 boards with minimal footprint Horizontal storage in six removable racks Adjustable Karry-Alls hold 75 boards in rigid molded ESD panels that are easy to adjust, hang inside our transport cart; more versatile and more storage space than any comparable cart. Click here to learn more… Fancort Industries Top Story   EMS grows less than ODM, still controls majority of industry The worldwide electronic manufacturing services industry grew at the annual rate of 17% in 2007, generating $268.1 billion in revenues, ... EDN Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Industry News   1-Source, ChipChecker Offer Anti-Counterfeit Service Under a mutual interest in mitigating the growing problem of counterfeit and defective parts, 1-Source Electronic Components Inc. and ... SMT IDC Predicts $3B Market for Low-Cost PCs The market for low-cost PCs such as the Asus Eee PC and the OLPC's XO could reach $3 billion in worldwide revenue by 2012, according to an ... eWeek The Promise and Pitfalls of E-Waste Takeback Companies all over the world are starting to realize the positive impact that green business initiatives can have on the bottom line. But for ... Greener Computing Agilent reports higher quarterly profit Agilent Technologies Inc. posted a higher quarterly profit Wednesday, led by stronger sales in the Asia Pacific region and double-digit ... EETimes Intel's shaken Chinese chip firm back to work by Friday Intel reckons it will be business as usual again this Friday for employees of the company’s chip packaging factory in the Chinese city ... The Inquirer HP targets silicon photonics Using silicon photonics to connect blades, boards, chips and eventually cores on the same chip has become a strategic goal for Hewlett ... EETimes Taiwan packaging and testing companies caution against quake-impact overreaction Despite concerns the 7.8-magnitude earthquake in Sichuan, China may have a possible impact over ongoing IC supply as Intel and Semiconductor ... DigiTimes Infineon merger speculation flares up again The German press has often speculated about the imminent replacement of Infineon CEO Wolfgang Ziebart. Financial Times Deutschland has now ... EETimes Foxconn Launches its Green Series Motherboards Foxconn has launched its first Green Series motherboards, thus focussing on providing energy-efficient personal computing products to its ... PC Magazine Middle & Near East Verizon and AT&T win Homeland Security contracts Verizon Business, said it has won a contract with the U.S. Department of Homeland Security worth around $678.5 million over 10 years. Verizon ... Reuters On Semi to close Slovakia fabs Seeking to cut costs, On Semiconductor plans to close its two wafer manufacturing facilities located in Piestany, Slovakia--a move that ... EETimes Broadband Printing – A Paradigm New white paper Miniature devices require smaller solder deposits compared to other components, a challenge arises to accommodate all devices on the PCB. "Broadband Printing" describes a robust printing process to deposit paste for all components on a board. Click to learn more. Speedline Technologies Technology News   Digital divide in U.S. closing slowly but still 'significant' The number of U.S. households with Internet access has increased about 11 percent since 2006, according to a study from marketing research ... Baltimore Business Journal Mitsubishi, Renesas Develop Solder Tool for Fine-Pitch BGAs Aimed at small-pitch ball grid array (BGA) packages, Mitsubishi Electric Corp. (Tokyo) and Renesas Technology Corp. (Tokyo) have jointly ... Semiconductor International LED Panel Indicators Offer Installation Diversity A line of professional-grade panel LED Indicators from APEM Components are available in package sizes of 6, 8, 12, 14, 16, 19 and 22 mm with ... ECN Magazine The Spider-Bots Are Coming The four principal members of the alliance are BAE Systems, which will lead the microsystems integration, the University of Michigan, which ... The Future of Things Gates Sees Boom Ahead in Home, Business Touchscreens You wouldn't have known that Microsoft Chairman Bill Gates is retiring in six weeks as the legendary tech executive and pioneer continues ... Internet News Quickly program SMT, AOI & ATE from CAD, Gerber or BOM Create fast process assembly sheets, 1st Article inspection, costing reports, rework, debug, etc. Cost effective manufacturing software & product tracking MES from Unisoft. Learn more… Unisoft Corporate News Submit New Ally In War On Counterfeit, Defective Electronic Components 1-Source Electronic Components, Inc. and ChipChecker, Ltd. have teamed up to provide a suite of material management services for wholesale ... 1-Source Electronic Components, Inc. EFD® Announces New Auger Valve System EFD, Inc. announces the Auger Valve System. Auger Valves are available in: Brush and brushless motor configurations, Fixed head version for ... EFD, Inc. New 4-Station Automatic Crimping Machine The CrimpCenter 64 HD is a fully automatic crimping machine for up to 4 processing stations for high quality processing of crimp and seal ... Schleuniger AWS Cemgraft announces Fast Track prototyping service AWS Cemgraft has announced its Fast Track prototyping service can turn around prototype or urgent low volume requests in five to ten days ... AWS Cemgraft Aegis to Showcase New Version 7 Software Release at NEW Aegis Software (Europe) Ltd. will showcase the recently launched Version V7 evolution of its proven NPI and MES software system at ... Aegis Software Adaptsys announces participation at National Electronics Week Adaptsys announces it will be exhibiting at National Electronics Week (NEW) 2008, taking place 17-19 June at Earls Court, London, UK, stand ... Adaptsys National Instruments at National Electronics Week 2008 With NI LabVIEW and modular cost-effective hardware, National Instruments is transforming the way engineers design, prototype and ... National Instruments New JTAG products at NEW JTAG Technologies will be using the National Electronics Week to unveil a number of new product developments, including enhancements to its ... JTAG Technologies OK International looks forward NEW 2008 OK International has confirmed plans to showcase a range of new product innovations at NEW being held in London’s Earls Court 2 venue from ... OK International Contax Supports National Electronics Week Contax Ltd confirms its support for the new industry exhibition, National Electronics Week. Contax will be taking two stands at the ... Contax BPM to Showcase Automated Handler for Flashstream Technology at NEW BPM Microsystems announces that it will display its latest Flashstream automated programming technology, the 3000FS, in distributor Adaptsys ... BPM Microsystems Heraeus - Celebrating 40 years of USA Manufacturing Excellence Heraeus has been developing, manufacturing and supporting Assembly Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials… Heraeus, Inc. Today's Sponsor Having Trouble with Profiling? Cutting-edge reflow profiling kit Heller is pleased to release its much anticipated reflow profiling kit. The leader in oven technology is now a leading provider of profiling technology. The reliability and ease-of-use you've come to expect from Heller, in a profiling kit. Learn more… Heller Industries   Providing High Reliability Class 3 CEM Services Technical Manufacturing Corporation Contract electronics manufacturer TMC specializes in the CLASS 3 production of printed circuit board and interconnecting cable assemblies for high-reliability applications with particular emphasis in the aerospace, defense, medical and automotive industries. Learn more… Technical Manufacturing Corporation   We are Boundary-Scan JTAG Technologies Brand new from JTAG Technologies at electronica 2008, Munich, booth A1.221: The Rack-Mountable Instrument, is a fully-featured DataBlaster controller together with a front-end QuadPOD, packaged into a convenient form factor that's perfect for mounting in a standard 19-inch equipment rack. Learn more… JTAG Technologies     Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Ask the Experts  |   Calendar  |   Corporate News  |   Contact Us Free Subscription  |   Industry Forums  |   Equipment Mart  |   Exclusives  |   Letters  |   Directory  |   News  |   Site Map  |   Viewpoint  |   White Papers Search Category    Entire Site Ask the Experts Circuitnet Information Corporate News Equipment Mart Event Calendar Exclusive Articles Industry Forums Industry/Technology News White Papers    Search Term    To search a phrase, place it in quotes. We search for industry news so you don't need to. 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