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May 15, 2008 - Click the title to read the full article.
Mitsubishi, Renesas Develop Solder Tool for Fine-Pitch BGAs
Aimed at small-pitch ball grid array (BGA) packages, Mitsubishi Electric Corp. (Tokyo) and Renesas Technology Corp. (Tokyo) have jointly ...
Semiconductor International
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September 5, 2008 - Industry News
Tegal Acquires Alcatel Micro Machining Systems in DRIE Move Aimed at TSVs
With 3-D wafer-level interconnects as a major target, Tegal Corp. said it will acquire the deep reactive ion etch (DRIE) and plasma enhanced ...
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July 11, 2008 - Top Story News
iNEMI Recommendations for Managing Lead-Free Solder Alloys
There are serious challenges associated with managing multiple lead-free solder alloys — in terms of both manufacturing and product ...
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June 2, 2008 - Technology News
Assessing Component Damage, Failure Risk
Ray Thomas, Sonoscan, Elk Grove Village, Ill., www.sonoscan.com; Paul Melville NXP Semiconductor, Eindhoven, Netherlands, www.nxp.com -- ...
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May 15, 2008 - Technology News
Mitsubishi, Renesas Develop Solder Tool for Fine-Pitch BGAs
Aimed at small-pitch ball grid array (BGA) packages, Mitsubishi Electric Corp. (Tokyo) and Renesas Technology Corp. (Tokyo) have jointly ...
Semiconductor International
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April 28, 2008 - Industry News
Researchers building mechanical computers, with moving parts...
In the 19th century, British mathematician Charles Babbage invented the "difference engine," a mechanical computer that had an enormously ...
Semiconductor International
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April 17, 2008 - Industry News
Gartner Downgrades 2008 Capex Spending Forecast
Gartner Inc. announced a downgrade to its forecast for the semiconductor capital equipment market, predicting a 19.8% contraction for this ...
Semiconductor International
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April 4, 2008 - Industry News
iNEMI Launching Studies of Lead-Free Alloys
The International Electronics Manufacturing Initiative (iNEMI, Herndon, Va.) said it is organizing projects related to lead-free alternatives, ...
Semiconductor International
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