OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, “Impact Strength of Lead-free BGA Spheres,” to the 18th Shanghai International SMT High Level Conference that is part of NEPCON China 2008 which is scheduled to take place from April 8 to April 11, 2008 at Shanghai Everbright Convention and Exhibition Centre.

Nihon Superior Shanghai’s Sales Manager, Eric Wei will present the paper at Shanghai Everbright International Hotel (2F Conference Room No.10) from 11:30am to 12:00am on Thursday April 10.

Since the electronics industry first became aware that it would have to change to lead-free soldering technologies to meet the requirements of the EU’s RoHS Directive there has been concern about criteria for the selection of alloys to replace the tin-lead solder on which the industry has previously relied. In the paper they are presenting at NEPCON Shanghai 2008 Nihon Superior seek to share their experience in identifying properties that they believe are relevant to the performance of an alloy as a reliable, user-friendly and cost-effective lead-free solder.

Nihon Superior will also exhibit at NEPCON China 2008 in booth 2C25, where representatives will be available to discuss the company’s newly expanded range of products based on their unique tin-copper-nickel-germanium lead-free solder SN100C, and to provide advice on practical problems encountered in the assembly of electronic circuitry.