NASHVILLE — Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, its CTO, will co-host the Cleaning & Alternatives Subcommittee with William Kenyon, Ph.D., Global Centre for Process Change Inc., on Monday, March 31, 2008 from 9 a.m. until noon.

This subcommittee is combining and updating four cleaning handbooks into a single document. This work is just beginning and addtional suppliers and users of cleaning mediums and equipment are invited to participate. The base documents are IPC-SC-60, “Post Solder Solvent Cleaning Handbook,” IPC-SA-61, “Post Solder Semi-Aqueous Cleaning,” IPC-AC-62, “Aqueous Post Solder Cleaning Handbook,” and IPC-CH-65, “Guidelines for Cleaning of Printed Boards and Assemblies.”