NASHVILLE — Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will introduce AQUANOX® A4651US Low pH Ultrasonic Immersion Cleaner to the North American electronics industry in booth 2219 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, 2008 in Las Vegas.

AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. This easy-to-use product provides exceptional cleaning on all of the latest flux formulations. A4651US will provide brilliant solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring. AQUANOX® A4651US is multi-metal safe including aluminum and copper.

AQUANOX® A4651US has proven compatible with all materials commonly used in

electronics assembly manufacturing and cleaning processes. Additionally, it is a biodegradable aqueous solution that contains no CFCs or HAPs. The Kyzen Applications Laboratory has evaluated AQUANOX® A4651US for effective removal of nearly 300 soldering materials from the worlds leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Amtech, Cobar, EFD, Florida CirTech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek, Shenmao.

AQUANOX® A4651US is available in one, five and 55 gallon containers.