Fine Line Stencil, Inc. is rolling out some major changes for 2008 to further strengthen its position as the leader in the competitive solder paste stencil industry.

Most notably the promotion of Robert Dervaes to “V.P. of Technology.” Mr. Dervaes has been the V.P. of Operations and Engineering for Fine Line Stencil for more than 10 years and in the electronics manufacturing industry for more than 15. With this new position, he will focus on developing and implementing new technology into Fine Line Stencil’s manufacturing processes and product lines.

“Our customers are our bosses and our goal has always been to give them the service and quality they need to efficiently and cost-effectively get their jobs done. Establishing this focus on technological advancement will ensure that we continue to meet this goal while offering our customers new solutions for today and tomorrow’s more challenging jobs,” says Mr. Dervaes.

Fine Line Stencil has already begun this implementation with the installation of LPKF’s MultiCut stencil laser, the industry’s fastest and most accurate. Two new stencil offerings will be also be available in 2008. The first is Slic^© stencil and will be available in January 2008. This stencil uses a proprietary metal that provides much smoother aperture walls when cut using lasers.

The second is electroform technology and will be available Q1 2008. An online order system will also be rolled out Q1 2008 that will allow customers to place orders and get updates online 24/7. However, this is only the beginning. Other products are in development and will be announced at a later date.