OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, “Properties that are Important in a Lead-free Solder,” to the Technical Conference that is part of the Printed Circuit Expo, APEX and the Designers’ Summit scheduled to take place April 1-3, 2008 at the Mandalay Bay Resort & Convention Center, Las Vegas.

The paper will be presented by Nihon Superior’s Senior Technical Adviser, Keith Sweatman in the Session “Solder Alloys”, which begins at 10.15am on Wednesday April 2.

Since the electronics industry first became aware that it would have to change to lead-free soldering technologies to meet the requirements of the EU’s RoHS Directive there has been concern about criteria for the selection of alloys to replace the tin-lead solder on which the industry has previously relied. In the paper they are presenting at APEX 2008 Nihon Superior seek to share their experience in identifying properties that they believe are relevant to the performance of an alloy as a reliable, user-friendly and cost-effective lead-free solder.

Nihon Superior will also exhibit at APEX 2008 in booth 249, where representatives will be available to discuss the company’s newly expanded range of products based on their unique tin-copper-nickel-germanium lead-free solder, SN100C_®, and to provide advice on practical problems encountered in the assembly of electronic circuitry.