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March 24, 2008
Inspecting DFN (Dual flat no lead) Packages
What are the requirements and how do we implement inspection process for DFN (Dual Flat No Lead) packages?
Can this only be accomplished with x-ray?
Peter Gong
H. W.
This "Ask the Experts" page has been viewed 531 times.
Ask the Experts Comments
March 24, 2008
Thinking of test from a structural perspective, this is a hidden joint and that makes it a viable candidate for x-ray inspection. X-ray inspection is perfect for hidden joints. That said, a good electrical solution would come with some of the advances in the in-circuit test arena.
Agilent specifically has a new iVTEP solution that is less reliant on the leadframe (compared to Testjet/VTEP) to capactively couple to and therefore should be able to provide good opens coverage. Food for thought!
Stacy Kalisz Johnson, Americas Marketing Development Manager
Agilent Technologies
stacy_johnson@agilent.com
 Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. With a strong process background, Stacy transitioned to the test and measurement equipment world in 2000. Stacy was an Automated Optical Inspection (AOI) and Automated X-ray Inspection (AXI) Product Manager for several years, respectively. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test.
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