HUDSON, NH — CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that its mobile measurement method is a perfect fit for statistical process control (SPC) requirements.

The main goals of SPC are to measure the production process in order to learn and adjust process parameters if necessary. This requires testing methods that assimilate regular production processes as closely as possible. CeTaQ methods offer that required flexibility.

Maintaining accuracy and repeatability of production equipment results in stable and capable production processes. SPC is the most common tool used to monitor and adjust production processes. Unfortunately, it is not possible to monitor SMT equipment accuracy and repeatability performance directly within the normal production process.

Most major suppliers develop individual methods for qualifying their own equipment. These are based on replacing real products with dummy products that are designed to make the critical machine performance measurable. Also, the measurement layout, number and type of components, board size, etc., are fixed, which does not create a “real world” scenario. However, CeTaQ’s measurement method is flexible in order to tailor the measurement layout, including number and type of components, board size, specific head, nozzle, placement angle configurations, and others more specific to machine requirements. This allows users to reach as closely as possible the condition in which the machine works in their daily production to find the root causes of weak points before they influence production quality.

The CeTaQ measurement method offers numerous benefits for all users at all levels of SPC integration. Successful implementation of SPC is critical in the reduction of defects from SMT processes, combined with CeTaQ’s measurement technique, awry processes can be easily brought back to within specification limits.