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March 17, 2008
Concerns with HDI
We are about to introduce HDI (High Density Interconnection Boards) in our production processes.
What are the main causes for concern regarding:
- Assembly process
- Reflow profiles
J. R.
This "Ask the Experts" page has been viewed 503 times.
Ask the Experts Comments
April 10, 2008
Take a look at Introduction to High Density Interconnection Substrates and Microvia Technologies authored by Happy Holden, TechLead Corp.
Marc Peo, President
Heller Industries Inc.
mpeo@hellerindustries.com
 Mr. Peo has been with Heller Industries for over 20 years and has been President for the past 8 years. Marc has authored several industry articles on Soldering, Flux collection, nitrogen use and Lead Free conversion and has served on the SMEMA Dual Rail committee, the APIA Consortium, the JARA Association and SMEMA Steering Committee.
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March 17, 2008
Depending on the type of solder paste and flux chemistry that you will be using and footprint, material of construction and type of components that you will be assembling, the reflow profile concerns are ramp up, soak time and cool down.
Most solder paste manufacturers will provide a nominal reflow profile that you can tweak to fit your particular PCB and component mix. If you are concerned about reflow issues and looking for a wider process window, I would recommend that you look at the possibility of using nitrogen atmosphere in your reflow furnace, with a maximum oxygen level of 1000 ppm in the reflow zone.
Gregory Arslanian, Global Segment Manager, Electronics Packaging, Assembly and Test
Air Products and Chemicals, Inc.
arslangk@airproducts.com
Mr. Arslanian has been involved in electronics packaging processing and equipment since 1981 including flipchip, TAB, wirebonding and die attach. He worked in the 3D molded interconnect industry prior to joining Air Products commercial technology and applications team. Current responsiblities include R&D, applications, marketing and customer interaction. Main focus is in inert atmosphere processing and fluxless soldering.
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March 17, 2008
High Density typically infers higher mass, higher complexity and higher cost. Higher Mass and Higher complexity in a standard convection process can create challenges relative to temperature saturation, peak temperatures on smaller parts etc.
The process I would suggest that will provide absolute control and protection against excessive over temperature and saturation would be a modern Vapor Phase process. Less expensive to run than convection systems and proven by the world’s largest manufacturing companies to provide better yields in HDI assemblies.
Allen W. Duck, CEO
ATEK llc
allen@atekllc.com
 Allen Duck is a 20-year Electronics Industry veteran with Global experience in multiple fields of technology and management. He started A-Tek in 2006 to provide a sales and service channel for international equipment companies wishing to offer value based solutions to USA companies.
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