OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper with DfR Solutions, titled “Accelerated Reliability Testing of Ni-Modified SnCu and SAC305,” to the Technical Conference that is part of the IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics scheduled to take place March 11, 2008 at the Sheraton Raleigh Hotel in Raleigh, North Carolina.

The paper will be presented by Keith Sweatman of Nihon Superior in conjunction with Joelle Arnold of DfR Solutions

Since the electronics industry first became aware that it would have to change to lead-free soldering technologies to meet the requirements of the EU’s RoHS Directive, there has been concern about criteria for the selection of alloys to replace the tin-lead solder on which the industry has previously relied. The paper being presented at the IPC/JEDEC International Conference identifies properties that are relevant to the performance of an alloy as a reliable, user-friendly and cost-effective lead-free solder.