OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled “High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys” authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.

The paper will be presented by Nihon Superior’s Senior Technical Adviser, Keith Sweatman on Monday, March 10^th.

Since the electronics industry first became aware that it would have to change to lead-free soldering technologies to meet the requirements of the EU’s RoHS Directive, there has been concern about criteria for the selection of alloys to replace the tin-lead solder on which the industry has previously relied. The paper being presented reports the results of impact fracture energy testing of a Sn-Cu-Ni lead-free eutectic alloy compared to a Sn-Ag-Cu alloy for BGA spheres.