South Plainfield, NJ, February 21, 2008- Cookson Electronics Assembly Materials is launching its new ALPHA® OM-350 lead-free solder paste with the unique, patented InnoLot® lead-free alloy formulation developed for use in applications requiring improved resistance to mechanical failure after exposure to thermal cycling and vibration.

ALPHA® OM-350 with InnoLot® alloy has a higher mean cycle time to failure versus SAC 387 based alloys. Significant work is underway with this product at major producers of under hood automotive applications such engine-mounted control modules. The product offers excellent fine feature printing on 0.3mm (12mil) circles and 0.4mm (16mil) pitch QFPs, and provides excellent electrical reliability. OM-350 meets the electrical reliability requirements of IPC SIR, Bellcore SIR and EM, JIS Electromigration and HP Electromigration.

“We are responding to the automotive industry need to increase electronic system reliability while decreasing the weight and complexity of wiring harnesses,” said Cookson Electronics’ Global Product Manager, Mitch Holtzer. ALPHA OM-350 with InnoLot alloy shows improved performance over SAC 387 based lead free solder, which can be important in applications like engine-mounted control modules where extreme temperature variations and vibration are commonplace.”

ALPHA® OM-350 with InnoLot alloy also provides extra process yield value derived from its excellent stencil life and print volume repeatability. Its voiding resistance exceeds IPC 7095 Class III requirements for low voiding, and its resistance to BGA head and pillow failures is excellent. For more information, go to www.alphametals.com/products/paste.