MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in the West Hall L1, booth 1A26 - at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

This new generation in-line, 100 percent inspection system takes the SE 300 to the next level. SE 300 Ultra provides accurate, repeatable results at speeds that keep up with increasing line cycle times. The SE 300 Ultra incorporates the field-proven technology and reliable features of the SE 300 along with new features.

New features include programming time and inspection set up improvements, SPC charts in the Operator User Interface, an optional system sensor with an extended height range that can measure paste height up to 24 mils (610 µm), and a mechanical board stop solution.

Other recent additions include 1- and 2-D multiple bar codes read using the system sensor, an offline defect review workstation to allow users to easily review defects offline to maximize production throughput technology-leading 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits, easy-to-use Operator Interface and Defect Review, and conveyor auto-width adjustment capability.

Offering ultra-fast inspection speeds, the system features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options — rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.

Additionally, the SE 300 Ultra provides the ability to handle odd-shaped pads, superior paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. The Ultra also features paste height, area and volume measurements with Gage R&R <10 percent.