Circuitnet Logo
   We search for industry news, so you don't need to.
 
Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Experts  I  Equipment  I  Circuitmart  I  Calendar




Corporate News Index
February 15, 2008

Cookson Electronics Launches New PV Products
 at the 2008 International Photovoltaic Power Generation Expo in Japan

Providence, RI, USA – Cookson Electronics Assembly Materials (CEAM) and ENTHONE®, units of Cookson Electronics, will participate in the 2008 International Photovoltaic Power Generation Expo in Tokyo, Japan, February 27-29. The following new products will be featured at this major annual solar industry event.  They represent Cookson Electronics’ commitment to develop technologies for the rapidly growing solar market.

PV Cell Metallization

Plating Chemistry:

ENTHONE® PV HELIOFABTM DPC Direct electrolytic copper plating onto conventional silver paste

ENTHONE® PV HELIOFABTM ELSP Direct electro-less nickel and copper plating on silicon

Conductive Inks: ALPHA® n:1000-IJ Silver Conductor: Developed to deliver high conductivity for ink jet applications

ALPHA® n:1000-SP Silver Conductor: Developed to deliver high conductivity for screen printing applications

Stencils:

ALPHA® FORM PV Electroformed Stencils: fine line printing of metallization lines with higher aspect Ratios

Screens:

ALPHA® SCREEN PV: for conventional thick film ink printing of metallization lines (USA).

PV Module Assembly

Flux-Coated Ribbon:

ALPHA® PV-READY RIBBON™: increase up-time by eliminating fluxing operations, including maintenance, labor and equipment

Preforms:

ALPHA® PV-READY Exactalloy® Preforms: resilient flux-coated solder/copper shapes integrate exact solder volume and flux activity for automated assembly of PV cell back-side interconnects; virtually eliminates VOC emissions

Flux:

ALPHA® PV-32 Flux: Rosin-containing, high reliability, Pb-Free/Sn-Pb capable tabbing and stringing flux

ALPHA® PV-61 Flux: Low solids, high reliability, Pb-Free/Sn-Pb capable tabbing and stringing flux

ALPHA® PV-80 Flux: Low Rosin, Pb-Free/Sn-Pb capable tabbing and stringing flux

Solder Paste:

ALPHA® PV-100 Solder Paste: no-clean, dispensable, Sn/Pb

ALPHA® PV-200 Solder Paste: no-clean, dispensable, Pb-free, halogen and halide-free

ALPHA® PV-300 Solder Paste: no-clean, dispensable, Pb-free, wide process window

As a worldwide leader in electronics materials and chemistry, Cookson Electronics offers unique solutions to the photovoltaic industry under its ENTHONE® and ALPHA® brands.

“The product technologies developed as a result of our intense R&D efforts will enable manufacturers to increase efficiency, while lowering their production costs and increasing their throughput and yield,” said Mike Marczi, Cookson’s Director of New Business Development.

The 2008 International Photovoltaic Power Generation Expo in Tokyo, Japan is an International exhibition with a focus on all types of devices, materials, equipment and technologies related to photovoltaic power generation. Solar cell, module manufacturers, system manufacturers, electrical-related companies, universities/national institutes involved in the PV market will attend the exhibition.

Contact:
Cookson Electronics

Paul Cote
http://www.cooksonelectronics.com

This page has been viewed 227 times.
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the electronics assembly and EMS
market. But you can't spend all day searching for them.


Let us do the searching for you.

Get a Free Subscription to Circuitnet

More from Cookson Electronics
October 1, 2008 - Corporate News
Cookson Electronics’ Engineered Products Group to Exhibit at Mexitronica
Cookson Electronics
September 10, 2008 - Corporate News
ALPHA® Virtual Trade Show Launched on Website
ALPHA
August 22, 2008 - Corporate News
Cookson Electronics' Achieves Certifications from BSI
Cookson Electronics'
August 15, 2008 - Corporate News
Cookson Electronics’ Engineered Products Group to Exhibit at SMTAI
Cookson Electronics
June 19, 2008 - Corporate News
Cookson Electronics’ Engineered Products Group Launches "First-Time-Right" NPI Stencils Initiative
Cookson Electronics
March 7, 2008 - Corporate News
Foseco Acquisition US Anti-trust Clearance Obtained
Cookson Group plc announces that it has now obtained the necessary anti-trust clearance from the United States Department of Justice in ...
Cookson Electronics
February 27, 2008 - Corporate News
Cookson Launches ALPHA® OM-350 Lead-Free Solder Paste
Cookson Electronics
February 15, 2008 - Corporate News
Cookson Electronics Launches New PV Products
Cookson Electronics
January 23, 2008 - Corporate News
Paul Lotosky Named Cookson Electronics’ Global Director - Customer Technical Suppor
Cookson Electronics
January 15, 2008 - Corporate News
Proposed sale of Foseco's Carbon Bonded Ceramics business to expedite Anti-trust clearances
Cookson Group plc announces that a conditional agreement was entered into to sell Foseco plc’s (“Foseco”) Carbon Bonded Ceramics business ...
Cookson Electronics
To find more articles from Cookson Electronics, use the search form below.





Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Ask the Experts  |   Calendar  |   Corporate News  |   Contact Us
Free Subscription  |   Industry Forums  |   Equipment Mart  |   Exclusives  |   Letters  |   Circuitmart  |   News  |   Site Map  |   Viewpoint  |   White Papers


Search Category       Search Term   
To search a phrase, place it in quotes.
We search for industry news so you don't need to.

Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA
Copyright © 2008 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager

Visit Semiconductor Packaging News for the latest semiconductor and advanced packaging news and information.