The constantly evolving lead free soldering environment requires solder paste suppliers to work closely with key customers to develop solutions that meet a wide range of requirements. The new S3X48 Series halide free no clean solder pastes from Koki Company Ltd. (Tokyo, Japan) demonstrate excellent performance across a wide range of lead free processing applications.

Developed originally for fine pitch BGA and CSP applications, the S3X48 Series solder pastes deliver excellent printability, superior performance at high reflow temperatures, and rapid wetting of all commonly used lead free alloys. A wide process window and 6 month shelf life allow any user to maintain optimum results independent of product type. In addition, the S3X48 solder pastes are especially useful in eliminating “pillow” defects on BGA and CSP devices.