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Gregory Arslanian Member No. 47078
Global Segment Manager, Electronics Packaging, Assembly and Test
Air Products and Chemicals, Inc.
arslangk@airproducts.com

Mr. Arslanian has been involved in electronics packaging processing and equipment since 1981 including flipchip, TAB, wirebonding and die attach. He worked in the 3D molded interconnect industry prior to joining Air Products commercial technology and applications team. Current responsiblities include R&D, applications, marketing and customer interaction. Main focus is in inert atmosphere processing and fluxless soldering.

Experts Questions Answered by Gregory Arslanian
Dec 15, 2008 Micro-balling with lead-free HASL and SAC alloy
Jul 14, 2008 Soldering Grid Array Packages
Mar 17, 2008 Bake for Repair
Mar 17, 2008 Concerns with HDI


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