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February 4, 2008
Voiding after under-fill
During our under-fill process we are noticing voiding after the fact.
Is there a tool used to see or test for voiding in an under-fill process?
Ray Whittier
VICOR
This "Ask the Experts" page has been viewed 475 times.
Ask the Experts Comments
February 4, 2008
The primary tool for this activity would be acoustic microscopy. There are primarily two companies in this space: Sonix and Sonoscan. You could also possibly use an infrared camera if the underfill is used for heat dissipation.
Dr. Craig D. Hillman, CEO & Managing Partner
DfR Solutions
chillman@dfrsolutions.com
 Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology and printed board failure mechanisms. Dr. Hillman has over 30 publications and has presented on a wide variety of reliability issues to over 150 companies and organizations.
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