|
|
|
|
January 28, 2008
Lower DPPM in PB free wave solder environment
We are building complex boards with 3000+ componentson boards with an OSP finish. We are usingwave solder as part of our lead freeprocess using SAC305 alloy.
Our current DPPM level for soldering is 400-500 and for solder voids is around 1000.
To improve our DPPM level we plan to install aNitrogen environment around the wave soldering tank to reduce oxidation.
Has anyone tried this and has it helped to reduce DPPM?
A. S.
This "Ask the Experts" page has been viewed 594 times.
Ask the Experts Comments
January 28, 2008
I would recommend that you also investigate the Wave Solder additive MS2 from PK Metals. This should improve the DPPM. We have seen it with other customers. Ask Larry Kay and PK Metals about the documented solder defect reduction and elimination of wave solder dross.
Terry Munson, President/Senior Technical Consultant
Foresite
terrym@residues.com
 Mr. Munson, President and Founder of Foresite, has extensive electronics industry experience applying Ion Chromatography analytical techniques to a wide spectrum of manufacturing applications. Terry is actively involved in the IPC and has served as session chair at technical seminars on contamination effects.
|
January 28, 2008
As a quick side note, most companies have moved away from SAC305 for wave soldering due to cost and manufacturability issues. You may want to consider the new Sn-Cu based alloys, such as SN100C from Nihon Superior and offerings from Kester.
Dr. Craig D. Hillman, CEO & Managing Partner
DfR Solutions
chillman@dfrsolutions.com
 Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology and printed board failure mechanisms. Dr. Hillman has over 30 publications and has presented on a wide variety of reliability issues to over 150 companies and organizations.
|
|
|
|
