COLORADO SPRINGS, Colorado – Photo Stencil has announced the 2008 schedule for its Stencil Technology and Design Workshops. These one-day sessions present in-depth information on optimizing stencil design and print process parameters to increase yields and reduce defects. Led by Bill Coleman, Ph.D., Photo Stencil’s vice president of technology, the workshops are ideal for process and quality engineers, production personnel and supervisors involved with printing, process control, solder paste selection or stencil design.

Major topics covered include the printing process and stencil technology; stencil design and stencil applications; process impact of lead-free solder paste; intrusive reflow; independent lab data on stencil print performance; and print process troubleshooting. The workshops are interactive in nature, and a comprehensive workbook including all reference information is provided to all attendees. A tour of the Photo Stencil facility is included at the end of each session. Attendees who order any type technology stencil prior to the class may arrange to view it during the manufacturing process.

The stencil technology workshops are held at the Photo Stencil headquarters in Colorado Springs, Colorado and run from 9:00 am to 4:00 pm. All workshops are held on Friday per the following schedule:

• January 25
• February 22
• March 14
• April 25
• May 30
• June 27
• July 25
• August 22
• September 19
• October 24
• November 21

The admission fee for the Stencil Technology and Design Workshop is $1000, which can be applied as credit against purchases made within 60 days of attendance. The sessions are available free of charge to existing Photo Stencil customers. For additional information, contact Dr. Bill Coleman at (719) 535-8525 or bcoleman@photostencil.com.