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December 7, 2007

Additive Circuits Makes BGA Modification Breakthough-Adds Missing Conductors Under BGA

Laconia, New Hampshire- Additive Circuits, Inc. uses it’s “Web-Circuit” technology to create solid copper connections between BGA pads.

 

There is no restriction in length and the new conductors can be as narrow as .005 inches to accommodate required routing. The technique is very repeatable and medium and high volume can be accommodated when needed. RoHS compliance can also be met. The new conductors are flat and reliable.

According to Arthur DesMarais, President, many customers have been forced to scrap valuable PCBs and delay production or settle for costly hand rework. Examples of applications include the simple ones depicted above as well as longer conductors coming out from under the BGA and in some cases terminating with new added SMT Pads. The process is compatible with most surface finishes and allows standard assembly methods to be used.

For more information contact Heather Yerry, heathery@additive.com

 

Contact:
Additive Circuits, Inc.

Art DesMarais
http://www.additive.com

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Additive Circuits Makes BGA Modification Breakthough-Adds Missing Conductors Under BGA
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