NORTH BILLERICA, Mass. — BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, has been awarded a Global Technology Award in the category of Soldering Equipment for its new PYRAMAX 100 Solder Reflow System. The award was presented by Global SMT & Packaging Magazine’s Publisher and Editor-in-Chief Trevor Galbraith at a Tuesday, November 13, 2007, ceremony during the Productronica Exposition in Munich, Germany.

The Global Technology Awards program is sponsored by Global SMT & Packaging Magazine, and is an annual celebration of product excellence in semiconductor packaging and electronics assembly. Premier products, based on the finest examples of creative advancement in technology in twenty-three key areas, are chosen by a distinguished panel of global industry experts.

“We are proud to receive this prestigious award,” said Paul van der Wansem, BTU chairman and CEO. “This award is another example of BTU’s continued commitment to providing innovative solutions to our customer’s needs, where excellence in product design delivers superior performance and the lowest cost of ownership.”

Featuring eight-zone air or nitrogen models, 350ºC maximum temperature, flexible platform configuration, low nitrogen and power consumption, and a comprehensive menu of options, the PYRAMAX 100 provides optimized lead-free processing, maximizing productivity and efficiency. “The PYRAMAX 100 takes lead-free production to the next level. The ability to control the process profile is enhanced by the use of eight zones in the heated section plus a cooling section that uses our programmable closed loop convection control,” said Rob DiMatteo, BTU product manager. “In addition, we’ve created the lowest cost of ownership through reductions in nitrogen and power consumption.”