Fremont, California – Dage Precision Industries, the industry leader in bondtesting technology, will showcase its newest bond test developments in Booth 608 at the IMAPS 2007 International Symposium on Microelectronics scheduled to take place on November 13-15, 2007 at the McEnery Convention Center in San Jose, California.

On display will be the Dage 4000HS High-Speed Bondtester with 2^nd generation high-speed cold bump pull (CBP) capability. The award winning 4000HS High-Speed Bondtester is particularly suitable for the detection of brittle fracture failures, a phenomenon that can occur with lead-free materials. The 4000HS provides bond energy data for failure mode analysis, and lead-free brittle fracture detection and is one of several tools that Dage provides for every bondtesting application.

High-speed cold bump pull offers several advantages over conventional shear testing and is an alternative to drop testing since studies recently completed using the 4000HS and high-speed CBP and high-speed shear testing have shown excellent correlation with board level drop testing.

JEDEC has recently published new standards for both high-speed shear and high-speed CBP. The Dage 4000HS High-Speed Bondtester with this new 2^nd generation high-speed cold bump pull capability assures full compliance with these new JEDEC standards and offers world class analysis of microelectronic solder joint integrity and reliability.

With America's headquarters located in Fremont, California, Dage Precision Industries, Inc. manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit http://www.dage-group.com/.