MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announced that it will feature SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth A4.262 with GPS Technologies at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

This new generation in-line, 100 percent inspection system takes the SE 300 to the next level. SE 300 Ultra provides accurate, repeatable results at speeds that keep up with increasing line cycle times. The SE 300 Ultra incorporates the field-proven technology and reliable features of the SE 300 along with new features.

New features for 2007 include 1-D and 2-D multiple bar codes read using the system sensor, an offline defect review workstation to allow users to easily review defects offline to maximize production throughput, an optional system sensor with an extended height range that can measure paste height up to 24 mils (610 µm), and a mechanical board stop solution.

Other recent additions include technology-leading 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits, easy-to-use Operator Interface and Defect Review, and conveyor auto-width adjustment capability.

Offering ultra-fast inspection speeds, the system features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options — rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.

Additionally, the SE 300 Ultra provides the ability to handle odd-shaped pads, superior paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. The Ultra also features paste height, area and volume measurements with Gage R&R <10 percent.