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July 30, 2007
Scribe lines for depaneling boards
Is there any standard or recommended specification used by board manufacturers for the depth of the scribe lines used to depanel boards? Appreciate your insight.
Brian Wall
NBI, Inc.
This "Ask the Experts" page has been viewed 653 times.
Ask the Experts Comments
July 30, 2007
A 30% score depth on each side should work. Pay attention to alignment of the two "V" cuts.
Prashant Joshi, Director of Engineering
Interconnect Systems Inc.
Prashant has 15 years experience in design and process development. With a MS in Mechanical/ Materials Engineering his areas of interest are connectors, electronics assembly, SMT, reballing, wire bond.
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July 30, 2007
The document you are looking for is IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Page 14 Fig 5-2 Provides all the information you will need to determine the Scoring parameters for depaneling the boards.
Leo Lambert, Vice President, Technical Director
EPTAC Corporation
leo@eptac.com
 At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee, covering areas of mounting, soldering, solderability and assembly.
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July 30, 2007
The specifications tend to be based on the web thickness (board remaining) rather then the depth of the scribe lines. I good place to go is Vscore Central.
Dr. Craig D. Hillman, CEO & Managing Partner
DfR Solutions
chillman@dfrsolutions.com
 Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology and printed board failure mechanisms. Dr. Hillman has over 30 publications and has presented on a wide variety of reliability issues to over 150 companies and organizations.
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