|
|
|
|
July 23, 2007
Intermetallic Spalling
What exactly is intermetallic spalling?
I am looking for more information on what spalling may do to a lead free solder joint life and strength.
L.F.
This "Ask the Experts" page has been viewed 856 times.
Ask the Experts Comments
July 30, 2007
Intermetallic spalling is usually used to describe the break up and migration of the secondary tin copper intermetallic into the solder joint. Since the predominant fatigue failure of lead free solder joints can be between the primary and secondary intermetallic layers spalling has the potential to have a significant impact in the overall performance of the joint.
For this reason there is substantial efforts being made to eliminate or at least limit the formation of the secondary intermetallic and thus enhance the overall performance of the solder joint.
Doug Dixon, Electronics Global Marketing Manager
Henkel Corp
doug.dixon@us.henkel.com
 Mr. Dixon has been in the electronics field for over twenty years and is the Marketing Manager with the electronics group of Henkel. Prior to joining Henkel, he worked for Raytheon as a Manufacturing Process Engineer, Camalot Systems as a manager for the Applications/Product Development/Field Service departments, and Universal Instruments as a Product Manager.
|
July 24, 2007
Spalling typically refers to delamination of a surface layer with some degree of curvature. I have not heard that term used in regards to intermetallics. If you can give me some more detail, I can provide some more feedback.
Dr. Craig D. Hillman, CEO & Managing Partner
DfR Solutions
chillman@dfrsolutions.com
 Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology and printed board failure mechanisms. Dr. Hillman has over 30 publications and has presented on a wide variety of reliability issues to over 150 companies and organizations.
|
|
|
|
