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Yun Zhang Member No. 40988
R&D Director
Cookson Electronics, Enthone

imageMs. Zhang has a PhD in chemistry/electrochemistry. Experiences include AT&T/Lucent Bell Labs, Technic, Cookson Electronics/Enthone. Areas of expertise include: electroplating; Sn whiskers, wafer bumping, Cu post/pillar, Cu redistribution lines and Sn and SnAg bumps.

Experts Questions Answered by Yun Zhang
May 14, 2007 Tin Whiskers
Aug 14, 2006 Coating to stop tin whisker growth?


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