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Edward Zamborsky |
Member No. 40986 |
Regional Sales Manager
OK International Inc.
 Mr. Zamborsky serves as one of OK's technology advisors to the Product Development group. Ed has authored many articles, and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
Experts Questions Answered by Edward Zamborsky
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Sep 8, 2008 |
Rework Circuits Under BGA's
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Sep 2, 2008 |
Lead Free Flux
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Aug 18, 2008 |
Voids in leadless packages
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Aug 11, 2008 |
Through Hole Soldering on 24 Layer Board
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Aug 4, 2008 |
Reflow BGA's with CSP's
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Aug 4, 2008 |
Recover Solder from Dross
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Jul 21, 2008 |
BGA Rework
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Jun 30, 2008 |
Multiple Lead-free Profile
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Jun 23, 2008 |
What is Jell Flux?
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Jun 16, 2008 |
Solder Components to Thin Flexible Circuits
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Jun 2, 2008 |
Leaded Solder on ROHS Compliant Parts
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May 12, 2008 |
How many zones are adequate for lead free profile
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May 12, 2008 |
Solder bridging on BGA's
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Apr 28, 2008 |
Reduce voids in QFN pb-free reflow process
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Apr 28, 2008 |
Carbon Dioxide generated and trapped by conformal coating
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Apr 21, 2008 |
Eutectic reflow for Pb-free BGAs
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Mar 17, 2008 |
Bake for Repair
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Feb 4, 2008 |
Lead Float
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Jan 21, 2008 |
Flux Deposition
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Jan 21, 2008 |
BGA bridging defects
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Dec 10, 2007 |
Pre clean boards before printing
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Dec 3, 2007 |
Part Movement During Reflow
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Nov 12, 2007 |
Rework Metal BGA's
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Nov 5, 2007 |
Voids in BGA's
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Oct 29, 2007 |
Component Shift During Reflow
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Oct 29, 2007 |
Wave soldering LCDs
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Oct 8, 2007 |
Keep package in place during reflow
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Oct 1, 2007 |
Clean before wave soldering
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Sep 23, 2007 |
Coating or encapsulating tin-lead solder joints?
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Sep 23, 2007 |
Solder Paste Hang up
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Sep 17, 2007 |
BGA Rework - with or without solder paste
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Sep 17, 2007 |
Voids in Solder Balls
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Jul 30, 2007 |
Wire stripping insulation prior to tinning
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Jul 2, 2007 |
BGA re-balling process
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Jun 18, 2007 |
Tombstone problems
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Jun 11, 2007 |
Hand soldering process
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Jun 4, 2007 |
Stencil printing process problems
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May 14, 2007 |
RFID Technology for Pick and Place feeders
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Apr 10, 2007 |
Should we buy new low cost assembly equipment
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Apr 10, 2007 |
Plating thickness for lead-free HASL
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Apr 2, 2007 |
Lead-free connector rework
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Mar 4, 2007 |
Books or Publications of today's electronics assembly
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Feb 19, 2007 |
Wave solder and reflow 0805 capacitors and resistors
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Jan 29, 2007 |
Temperature Time Transformation
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Jan 29, 2007 |
Lead-free soldering problem
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Jan 22, 2007 |
Double sided SMT
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Jan 22, 2007 |
Cleaning PCB Boards with window cleaner?
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Jan 22, 2007 |
Small component rework
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Dec 27, 2006 |
Hand soldering skills
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Nov 5, 2006 |
Tombstone problems
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Oct 2, 2006 |
Proper hand soldering settings
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Sep 18, 2006 |
Hand soldering for Lead-Free
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Aug 14, 2006 |
Coating to stop tin whisker growth?
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Jul 31, 2006 |
Hand-held XRF system question
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Jun 29, 2006 |
Regarding lead free, can I use the reflow ovens I currently have in production?
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Jun 29, 2006 |
What should the average temperature and humidity level be in an electronic assembly facility?
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