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Edward Zamborsky |
No. 40986 |
Regional Sales Manager
OK International Inc.
Mr. Zamborsky serves as one of OK's technology advisors to the Product Development group. Ed has authored articles and papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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Experts Questions Answered by Edward Zamborsky
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Aug 30, 2010 |
SMT Components Popping Off During Reflow
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Jul 6, 2010 |
Options for Reducing Dross
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Jun 28, 2010 |
Through Hole Component Phase Out
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Jun 1, 2010 |
What Causes Chip Component Blow Out
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Jun 1, 2010 |
What is the Shelf Life for a Syringe of Solder Paste
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May 24, 2010 |
Humidity Inside Our Screen Printer
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May 24, 2010 |
Lead-Free Profile on Tin/Lead Assemblies
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May 17, 2010 |
BGA Rework Flux Recommendation
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Apr 5, 2010 |
Lead-free Assemblies Reworked with Leaded Solder
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Mar 8, 2010 |
Contamination Prior to Conformal Coating
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Mar 1, 2010 |
Is Baking Required After Aqueous Cleaning?
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Feb 22, 2010 |
Most Difficult Components to Hand Solder
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Feb 1, 2010 |
BGA Shifting During Reflow
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Dec 14, 2009 |
Tombstoning Dilemma
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Dec 7, 2009 |
SN96 Solderability Issues
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Dec 7, 2009 |
SMT Component Lead Oxidation
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Nov 23, 2009 |
Concerns Using Hand Sanitizers
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Nov 2, 2009 |
Hand Soldering Alternative
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Oct 26, 2009 |
Tacky Flux Residue Problem
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Oct 19, 2009 |
Issues with BGA Components Near PCB Edges
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Sep 28, 2009 |
Solder Joint Explosions
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Sep 21, 2009 |
Components Lifting During Wave Soldering
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Sep 14, 2009 |
Hard Water Contamination
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Sep 14, 2009 |
Solder Joint Rework Question
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Aug 31, 2009 |
Mysterious Solder Balls
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Aug 31, 2009 |
Small chip cap rework advise
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Aug 10, 2009 |
Reworked BGA component bridging at the corners
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Aug 5, 2009 |
SMT Component Shift
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Jul 27, 2009 |
Estimated SMT component placement cost
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Jun 29, 2009 |
How to Clamp Odd Shaped Circuit Boards
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Jun 1, 2009 |
Technology to Measure Oxidation Levels
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Jun 1, 2009 |
Blow Holes on Clinched Radial Lead Components
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May 26, 2009 |
Which term to use, PWB or PCB?
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Mar 2, 2009 |
Measuring component height after reflow
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Mar 2, 2009 |
Ideal humidity for circuit board assembly
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Feb 2, 2009 |
Conformal Coating & Humidity
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Jan 26, 2009 |
BGA Replacement limit
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Jan 26, 2009 |
Wave solder process issue
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Dec 14, 2008 |
Micro-balling with lead-free HASL and SAC alloy
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Dec 8, 2008 |
Double Sided Reflow
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Nov 24, 2008 |
Solder Bump QFN's
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Nov 10, 2008 |
Opens on BGA solder joints after reflow soldering
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Oct 13, 2008 |
Solder to a thin flexible circuit
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Sep 8, 2008 |
Rework Circuits Under BGA's
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Sep 2, 2008 |
Lead Free Flux
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Aug 18, 2008 |
Voids in leadless packages
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Aug 11, 2008 |
Through Hole Soldering on 24 Layer Board
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Aug 4, 2008 |
Reflow BGA's with CSP's
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Aug 4, 2008 |
Recover Solder from Dross
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Jul 21, 2008 |
BGA Rework
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Jun 30, 2008 |
Multiple Lead-free Profile
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Jun 23, 2008 |
What is Jell Flux?
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Jun 16, 2008 |
Solder Components to Thin Flexible Circuits
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Jun 2, 2008 |
Leaded Solder on ROHS Compliant Parts
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May 12, 2008 |
How many zones are adequate for lead free profile
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May 12, 2008 |
Solder bridging on BGA's
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Apr 28, 2008 |
Reduce voids in QFN pb-free reflow process
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Apr 28, 2008 |
Carbon Dioxide generated and trapped by conformal coating
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Apr 21, 2008 |
Eutectic reflow for Pb-free BGAs
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Mar 17, 2008 |
Bake for Repair
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Feb 4, 2008 |
Lead Float
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Jan 21, 2008 |
Flux Deposition
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Jan 21, 2008 |
BGA bridging defects
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Dec 10, 2007 |
Pre clean boards before printing
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Dec 3, 2007 |
Part Movement During Reflow
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Nov 12, 2007 |
Rework Metal BGA's
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Nov 5, 2007 |
Voids in BGA's
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Oct 29, 2007 |
Component Shift During Reflow
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Oct 29, 2007 |
Wave soldering LCDs
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Oct 8, 2007 |
Keep package in place during reflow
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Oct 1, 2007 |
Clean before wave soldering
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Sep 23, 2007 |
Coating or encapsulating tin-lead solder joints?
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Sep 23, 2007 |
Solder Paste Hang up
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Sep 17, 2007 |
BGA Rework - with or without solder paste
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Sep 17, 2007 |
Voids in Solder Balls
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Jul 30, 2007 |
Wire stripping insulation prior to tinning
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Jul 2, 2007 |
BGA re-balling process
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Jun 18, 2007 |
Tombstone problems
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Jun 11, 2007 |
Hand soldering process
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Jun 4, 2007 |
Stencil printing process problems
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May 14, 2007 |
RFID Technology for Pick and Place feeders
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Apr 10, 2007 |
Should we buy new low cost assembly equipment
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Apr 10, 2007 |
Plating thickness for lead-free HASL
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Apr 2, 2007 |
Lead-free connector rework
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Mar 4, 2007 |
Books or Publications of today's electronics assembly
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Feb 19, 2007 |
Wave solder and reflow 0805 capacitors and resistors
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Jan 29, 2007 |
Temperature Time Transformation
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Jan 29, 2007 |
Lead-free soldering problem
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Jan 22, 2007 |
Double sided SMT
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Jan 22, 2007 |
Cleaning PCB Boards with window cleaner?
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Jan 22, 2007 |
Small component rework
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Dec 27, 2006 |
Hand soldering skills
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Nov 5, 2006 |
Tombstone problems
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Oct 2, 2006 |
Proper hand soldering settings
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Sep 18, 2006 |
Hand soldering for Lead-Free
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Aug 14, 2006 |
Coating to stop tin whisker growth?
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Jul 31, 2006 |
Hand-held XRF system question
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Jun 29, 2006 |
Regarding lead free, can I use the reflow ovens I currently have in production?
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Jun 29, 2006 |
What should the average temperature and humidity level be in an electronic assembly facility?
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