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Umut Tosun No. 40980
Umut Tosun Application Technology Manager
Zestron America

Mr. Tosun has published numerous technical articles. As an active member of the SMTA and IPC organizations, Mr. Tosun has presented a variety of papers and studies on topics such as "Lead-Free Cleaning" and "Climatic Reliability".
Experts Questions Answered by Umut Tosun
Aug 23, 2010 Post Print Inspection Issue
Aug 16, 2010 Pros and Cons of Cleaning No-clean
Aug 9, 2010 Flux Residue Causing Test Issues
Apr 26, 2010 Organic Flux Residue Concerns
Mar 29, 2010 Cleaning No-Clean Solder Paste
Mar 1, 2010 Is Baking Required After Aqueous Cleaning?
Feb 15, 2010 Contact Pin Corrosion Problems
Feb 15, 2010 Which to Use - Rosin Flux or Water Soluble?
Jan 11, 2010 Flux Residue Visible After 3 Months
Nov 9, 2009 Hot or Cold DI Water Rinse
Oct 26, 2009 Tacky Flux Residue Problem
Sep 14, 2009 Hard Water Contamination
Jul 20, 2009 Can adhesive residues from tapes contaminate a cleaning solution?
Jul 20, 2009 Staging time between wave soldering and cleaning
Jul 6, 2009 No clean flux stains during reflow
Jun 22, 2009 Ultrasonic Cleaning Causing Damage
Jun 15, 2009 What is the Proper DI Water Resistivity
Feb 23, 2009 Problem with 'No Clean' Solder Flux Residue
Jan 21, 2009 DI Resistivity for Wafer Dicing and Cleaning
Dec 14, 2008 IPA cleaning precautions
Dec 8, 2008 Recommended DI Water Conductivity For Ultrasonic Cleaning
Dec 1, 2008 Cleaning PCB's after long-term storage
Sep 2, 2008 Clean water soluble flux
Jul 28, 2008 Clean a no clean PCBA
Jun 30, 2008 Best Board Cleaning Methodology
Jan 7, 2008 Resistivity and Cleaning
Oct 8, 2007 Method for cleaning boards after misprint
Nov 1, 2006 Cleaning an assembled board with IPA
Oct 10, 2006 Stencil printing lead free paste
Oct 10, 2006 Aqueous Cleaning Process
Aug 22, 2006 Is lead contamination during cleaning of PB-free stencils possible?
Apr 13, 2006 Cleaning military circuit boards contaminated with sand, dirt, grime, oil...

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