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Dr. Brian Toleno |
Member No. 40979 |
Application Engineering
Henkel Technologies
brian.toleno@us.henkel.com
 Dr. Brian Toleno is the Application Engineering Team leader for Henkel Technologies. He is responsible for the technical service and application engineering for Henkel's electronics assembly materials, including solder paste, underfills, PCB protection materials, and underfills. He holds a Ph.D. in Analytical Chemistry from The Pennsylvania State University and a B.S. degree in Chemistry from Ursinus College.
Experts Questions Answered by Dr. Brian Toleno
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Oct 27, 2008 |
Adhesive for sensor attachment
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Oct 6, 2008 |
Oxidation on pads causes poor solder joints
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Oct 6, 2008 |
IR Reflow Issue
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May 5, 2008 |
Reduce voids in QFN pb-free reflow process
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Sep 9, 2007 |
Reflow for leaded and lead-free assemblies
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Aug 20, 2007 |
Good epoxy or cement for bonding BGA packages to PCB
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Jul 16, 2007 |
SMT adhesive problems after wave solder process
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Feb 4, 2007 |
Baking lead-free and lead PCB’s before assembly
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Feb 4, 2007 |
Reflow parameters for lead-free BGA
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Dec 4, 2006 |
Oxidation on plated through holes
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Nov 20, 2006 |
Proper method to bake PCB's
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Oct 30, 2006 |
Tin lead soldering of lead free components
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Oct 30, 2006 |
Cleaning an assembled board with IPA
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Oct 23, 2006 |
Wave Soldering creating blowhole problems
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Sep 5, 2006 |
Lead free BGA's and HASL
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Sep 5, 2006 |
Help debugging wetting problems
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Aug 16, 2006 |
Coating to stop tin whisker growth?
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Aug 7, 2006 |
Studies showing the effects of PCB finish on manufacturability
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May 18, 2006 |
Is it possible to run Pb-Free reflow without nitrogen?
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May 3, 2006 |
RoHS existing products vs. new products
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Apr 23, 2006 |
Can PCB's designed for Sn/Pb be used in a Pb free assembly?
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Apr 13, 2006 |
Advise and suggestions for assembly using 01005 capacitors.
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Apr 5, 2006 |
Lead-free solder pastes drop-in replacements?
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Apr 3, 2006 |
BGA rework pre-bake. Yes or no?
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