We search for industry news, so you don't need to.   Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Experts  I  Equipment  I  Circuitmart  I  Calendar Ask the Experts Panel Submit A Question  |   Index Neil O'Brien Member No. 40961 Sales Director Finetech neil@finetechusa.com Neil O'Brien has worked in the field of electronic manufacturing equipment for over fifteen years and is currently Sales Director for Finetech, a manufacturer of precision rework systems and die bonders. Neil has recently published a paper on 0201 Component Rework and presented at a lead-free rework workshop series. Experts Questions Answered by Neil O'Brien Oct 13, 2008 Solder to a thin flexible circuit Sep 17, 2007 BGA Rework - with or without solder paste Jul 2, 2007 BGA re-balling process Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Ask the Experts  |   Calendar  |   Corporate News  |   Contact Us Free Subscription  |   Industry Forums  |   Equipment Mart  |   Exclusives  |   Letters  |   Circuitmart  |   News  |   Site Map  |   Viewpoint  |   White Papers Search Category    Entire Site Ask the Experts Circuitnet Information Corporate News Equipment Mart Event Calendar Exclusive Articles Industry Forums Industry/Technology News White Papers    Search Term    To search a phrase, place it in quotes. We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Semiconductor Packaging News for the latest semiconductor and advanced packaging news and information.