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Alan Lewis |
Member No. 40951 |
Director of Application Engineering
Asymtek
alewis@asymtek.com
 Mr. Lewis worked for The Aerospace Corporation for 6 years before joining Asymtek in 1993. He holds multiple patents in dispenseing technology for electronics assembly and packaging. He has a Master's Degree in Mechnical Engineering from University of Missouri-Rolla.
Experts Questions Answered by Alan Lewis
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May 27, 2008 |
Changing Conformal Coating Material
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Oct 29, 2007 |
Wave soldering LCDs
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Sep 23, 2007 |
Coating or encapsulating tin-lead solder joints?
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Sep 17, 2007 |
BGA Rework - with or without solder paste
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Sep 4, 2007 |
Control Electronic Static Discharge
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Aug 20, 2007 |
Good epoxy or cement for bonding BGA packages to PCB
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Jul 16, 2007 |
SMT adhesive problems after wave solder process
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Feb 4, 2007 |
Baking lead-free and lead PCB’s before assembly
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Dec 18, 2006 |
Component baking issues
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Nov 20, 2006 |
Proper method to bake PCB's
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Oct 23, 2006 |
Reflow oven profilers
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Jun 14, 2006 |
Pre-wash boards prior to conformal coating
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