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Leo Lambert |
No. 40948 |
Vice President, Technical Director
EPTAC Corporation
leo@eptac.com
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
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Experts Questions Answered by Leo Lambert
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Jun 28, 2010 |
Through Hole Component Phase Out
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May 17, 2010 |
Rules for Reusing Components
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May 10, 2010 |
Can Water be Harmful to Electronics Components?
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May 10, 2010 |
Lifted Leads on QFP
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May 5, 2010 |
Solder Fillet Peaks
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May 3, 2010 |
Recommendation for PCB Surface Finish
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Apr 19, 2010 |
PCB Handling and Storage Concerns
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Mar 29, 2010 |
Cleaning No-Clean Solder Paste
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Mar 1, 2010 |
Is Baking Required After Aqueous Cleaning?
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Feb 15, 2010 |
Which to Use - Rosin Flux or Water Soluble?
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Oct 26, 2009 |
Class 2 vs. Class 3 Distinction
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Aug 5, 2009 |
SMT Component Shift
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May 26, 2009 |
Which term to use, PWB or PCB?
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May 18, 2009 |
Recommended lead to hole ratio
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Mar 30, 2009 |
Alternative to Conformal Coating
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Mar 30, 2009 |
Screen Print Shelf Life
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Feb 23, 2009 |
Re-certify a reflow oven
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Jan 26, 2009 |
Wave solder process issue
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Oct 20, 2008 |
Cleaning No-clean Flux
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Oct 20, 2008 |
Tin-lead and no-lead compatibility issues
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Sep 8, 2008 |
Rework Circuits Under BGA's
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Sep 8, 2008 |
Halogen Free tin lead or pb free
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Aug 18, 2008 |
What is the correct coupon for moister and insulation test
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Aug 11, 2008 |
Wave Soldering Problems
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Aug 11, 2008 |
Through Hole Soldering on 24 Layer Board
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Aug 4, 2008 |
Recover Solder from Dross
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Aug 4, 2008 |
Reflow BGA's with CSP's
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Jul 6, 2008 |
Humidity and Corrosion
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Jul 1, 2008 |
Best Board Cleaning Methodology
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Jun 16, 2008 |
Urethane Conformal Coating Problem
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Jun 16, 2008 |
Solder Components to Thin Flexible Circuits
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Jun 9, 2008 |
Solder Deposits on Components During Wave Soldering
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May 27, 2008 |
No-Clean Flux: How much is too much?
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May 12, 2008 |
Solder bridging on BGA's
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May 12, 2008 |
How many zones are adequate for lead free profile
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Feb 25, 2008 |
Acceptable Number of Repairs
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Feb 25, 2008 |
How much Board Baking is to much?
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Feb 4, 2008 |
Lead Float
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Jan 14, 2008 |
Solder Paste Replenishment
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Jan 2, 2008 |
Zinc in solder
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Dec 3, 2007 |
Part Movement During Reflow
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Nov 19, 2007 |
Maximum thermal stress temperatures
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Nov 19, 2007 |
Pros and cons of HASL, OSP and Immersion Gold
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Oct 29, 2007 |
Wave soldering LCDs
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Oct 29, 2007 |
Component Shift During Reflow
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Sep 23, 2007 |
Coating or encapsulating tin-lead solder joints?
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Sep 4, 2007 |
Deflux Eutectic and Lead-Free Assemblies
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Sep 4, 2007 |
Control Electronic Static Discharge
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Aug 27, 2007 |
Conformal Coating Specification Violation
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Jul 30, 2007 |
Scribe lines for depaneling boards
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Jul 30, 2007 |
Wire stripping insulation prior to tinning
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Jul 30, 2007 |
SMT Epoxy for lead-free wave
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Jul 2, 2007 |
Any "Standards" on pad repairs?
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Jun 25, 2007 |
Monitoring temperature and humidity
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Jun 25, 2007 |
Lead Free BGA Reflow
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Jun 11, 2007 |
Using tin-lead solder on RoHS parts
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Apr 15, 2007 |
HASL and solder mask process?
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Apr 15, 2007 |
Jumper wire guidelines
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Apr 2, 2007 |
Cleaning tin-lead and lead-free boards
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Mar 4, 2007 |
Lead-free bar solder for wave soldering
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Mar 4, 2007 |
Books or Publications of today's electronics assembly
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Mar 4, 2007 |
Cleaning solvent to replace Forane 141b?
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Jan 22, 2007 |
Small component rework to IPC spec.
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Jan 22, 2007 |
Cleaning PCB Boards with window cleaner?
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Jan 22, 2007 |
Double sided SMT
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Dec 27, 2006 |
Hand soldering skills
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Dec 18, 2006 |
OSP Board rework and cleaning
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Dec 11, 2006 |
Reflow and wave soldering OSP Boards
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