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Kenneth Kirby |
Member No. 40945 |
Applications Engineer
Speedline Technologies
Mr. Kirby has been in the electronics manufacturing industry for 18 plus years. Over the years Ken has been in roles such as Equipment and Process trainer, Senior Process Engineer, R&D Application Development Engineer and currently Process Application Engineer.
Experts Questions Answered by Kenneth Kirby
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Nov 24, 2008 |
Define Blow Holes
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Jun 9, 2008 |
Solder Deposits on Components During Wave Soldering
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Jun 2, 2008 |
Leaded Solder on ROHS Compliant Parts
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Jan 2, 2008 |
Zinc in solder
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Dec 10, 2007 |
Preheat problems with mixed technology process
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Dec 10, 2007 |
Impact of humidity on wave soldering process
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Nov 5, 2007 |
Spray fluxer in wave solder
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Oct 29, 2007 |
Wave soldering LCDs
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Oct 17, 2007 |
Cleaning residue after wave solder process
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Oct 1, 2007 |
Clean before wave soldering
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Aug 5, 2007 |
Changing PCB finish from FR2 OSP to FR4 HASL-Lead Free
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Apr 15, 2007 |
HASL and solder mask process?
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Dec 11, 2006 |
Reflow and wave soldering OSP Boards
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Oct 23, 2006 |
Wave Soldering creating blowhole
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Oct 23, 2006 |
Reflow oven profilers
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Sep 18, 2006 |
Removing oxidation from partially assembled boards
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Jul 23, 2006 |
Can we pour left over paste into the solder pot?
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Jul 10, 2006 |
Can we convert our existing wave soldering machine to use lead free?
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Jul 10, 2006 |
Interested in using Immersion silver PCB's for RoHS compliance?
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Jun 29, 2006 |
What should the average temperature and humidity level be in an electronic assembly facility?
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Jun 7, 2006 |
What is the best method to select a spray fluxer?
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